ILPS22QSTR

STMicroelectronics
511-ILPS22QSTR
ILPS22QSTR

Mfr.:

Description:
Board Mount Pressure Sensors Dual full-scale 1260hPa 4060hPa absolute digital output barometer embedded Qvar

ECAD Model:
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Availability

Stock:
0

You can still purchase this product for backorder.

On Order:
12 353
Expected 4/28/2026
Factory Lead Time:
22
Weeks Estimated factory production time for quantities greater than shown.
Long lead time reported on this product.
Minimum: 1   Multiples: 1   Maximum: 300
Unit Price:
kr -,--
Ext. Price:
kr -,--
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 8000)

Pricing (NOK)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™
kr 35,38 kr 35,38
kr 30,51 kr 152,55
kr 28,07 kr 280,70
kr 24,82 kr 1 241,00
kr 23,43 kr 2 343,00
Full Reel (Order in multiples of 8000)
kr 23,43 kr 187 440,00
† A MouseReel™ fee of kr 50,00 will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable.

Product Attribute Attribute Value Select Attribute
STMicroelectronics
Product Category: Board Mount Pressure Sensors
RoHS:  
Absolute
26 kPa to 406 kPa
Digital
SMD/SMT
I2C, SPI
LGA-10
- 40 C
+ 105 C
Reel
Cut Tape
MouseReel
Brand: STMicroelectronics
Moisture Sensitive: Yes
Operating Supply Current: 11.7 uA
Product Type: Board Mount Pressure Sensors
Factory Pack Quantity: 8000
Subcategory: Sensors
Supply Voltage - Max: 3.6 V
Supply Voltage - Min: 1.7 V
Unit Weight: 7 mg
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CNHTS:
8542391090
CAHTS:
8542390000
USHTS:
8542390090
TARIC:
9026208090
MXHTS:
8542399999
ECCN:
EAR99

ILPS22QS Absolute Digital Output Barometer

STMicroelectronics ILPS22QS Absolute Digital Output Barometer is an ultra-compact piezoresistive absolute pressure sensor that operates as a digital output barometer. The ILPS22QS supports dual full-scale up to user-selectable 4060hPa. The ILPS22QS features ultra-low pressure noise with very low power consumption.

MEMS Pressure Sensors

STMicroelectronics MEMS Pressure Sensors use innovative MEMS technology to provide extremely high-pressure resolution, in ultra-compact and thin packages. The devices are designed using ST's VENSENS technology, allowing the fabrication of pressure sensors on a monolithic silicon chip. This eliminates wafer-to-wafer bonding and maximizes reliability.