GS66502B-TR

Infineon Technologies
499-GS66502B-TR
GS66502B-TR

Mfr.:

Description:
GaN FETs 650V, 7.5A, Bottom-Side Cooled E-mode GaN Transistor

ECAD Model:
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Availability

Stock:
0

You can still purchase this product for backorder.

On Order:
1 891
Factory Lead Time:
53
Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 1891 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
kr -,--
Ext. Price:
kr -,--
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 3000)

Pricing (NOK)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™
kr 125,98 kr 125,98
kr 102,54 kr 1 025,40
kr 85,49 kr 8 549,00
kr 76,21 kr 38 105,00
kr 73,08 kr 73 080,00
Full Reel (Order in multiples of 3000)
kr 62,06 kr 186 180,00
† A MouseReel™ fee of kr 50,00 will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable.

Product Attribute Attribute Value Select Attribute
Infineon
Product Category: GaN FETs
RoHS:  
SMD/SMT
HEMT
1 Channel
650 V
7.5 A
260 mOhms
- 10 V, 7 V
2.6 V
1.6 nC
- 55 C
+ 150 C
Enhancement
GaNPX
Brand: Infineon Technologies
Configuration: Single
Development Kit: GS665MB-EVB
Maximum Operating Frequency: 10 MHz
Minimum Operating Frequency: 0 Hz
Moisture Sensitive: Yes
Packaging: Reel
Packaging: Cut Tape
Packaging: MouseReel
Product Type: GaN FETs
Series: GS665xx
Factory Pack Quantity: 3000
Subcategory: Transistors
Technology: GaN
Transistor Type: E-Mode
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CNHTS:
8541290000
USHTS:
8541290065
ECCN:
EAR99

GS665xx Enhancement-Mode Silicon Power Transistors

Infineon Technologies GS665xx Enhancement-Mode High Electron Mobility Transistors (E-HEMT) feature high current, high voltage breakdown, and high switching frequency. These power transistors include Island Technology cell layout with high-current die and high yield, and GaNPX®  small packaging enables low inductance and low thermal resistance. These power transistors offer very low junction-to-case thermal resistance for high-power applications. The GS665xx enhancement-mode silicon power transistors are available as bottom-sided or top-sided cooled transistors. These power transistors provide ultra-low FOM die, reverse current capability, and zero reverse recovery loss.