ADLINK Technology Thermal Solutions for Express-BD7 COMs extend the lifespan of computer-on-modules by dissipating heat. These thermal solutions include heat spreaders, which conduct heat to other system cooling components, passive heatsinks, which dissipate heat using cooling fins, and active heatsinks, which include a cooling fan. These ADLINK thermal solutions are specifically designed for the Express-BD7 Modules, ensuring a custom fit and preventing mechanical stress.
Extends the lifespan of Computer-on-Modules by dissipating heat
Includes heat spreaders, passive heatsinks, and active heatsinks
Specifically designed for the Express-BD7 Modules
ADLINK Technology Express-BD7 Computer-on-Modules
COM Express Basic Size Type 7 Module with Up to 16 cores Intel Xeon D and Pentium D SoC.