Amphenol TCS InfinX™ High-Speed Mezzanine Connectors are parallel board-to-board connectors capable of supporting data rates up to 25Gbp/s. Optimized for differential signaling, the InfinX High-Speed Mezzanine Connectors feature rugged wafer construction with non-stubbing mating interface and Amphenol's patented "resonance dampening" technology. Developed to meet the demand for increasing bandwidth in mezzanine applications, these connectors are scalable from 10mm to 40mm stack height, and can be selectively loaded with wafers optimized for high-speed differential, single-ended and power.
Supports data rates up to 25Gb/s
Uses Amphenol's patented "Resonance Dampening" technology for exceptionally low crosstalk and resonances
Optimized for differential signals
BGA "Blade in Ball" technology for solder joint reliability
Can be selectively loaded with wafers optimized for high-speed differential, single-ended, and power