Bergquist Company TGP 7000ULM 7W/m-K, Extremely Soft GAP PAD®
Bergquist Company TGP 7000ULM 7W/m-K, Extremely Soft GAP PAD® are soft gap-filling materials for high-performance applications requiring low assembly stress. These materials offer exceptional thermal performance at low pressures due to the unique filler package and ultra-low modulus resin formulation. The 7000ULM gap-filling materials are highly conformal to rough or irregular surfaces and allow excellent wet-out at the interface. This Bergquist Company TGP 7000ULM series features 7W/m·k thermal conductivity and operates in a -60°C to +200°C temperature range. These materials offer a UL 94V-0 flammability rating.
Features
- Low assembly stress due to ultra-low modulus
- Excellent conformability to rough or irregular surfaces
- Thorough wet out at the interface for maximized thermal transfer
- High thermal conductivity
- Simplified application and processability
- Ultra-low modulus
- High compliance
- Protective liners for easy usage
Applications
- Telecommunications
- Routers
- Switches
- Base stations
- ASICs and DSPs
- Consumer electronics
- Thermal modules to heat sinks assembly
Specifications
- 7W/m∙K thermal connectivity
- 152kPa Young's modulus
- UL 94V-0 flammability rating
- -60°C to +200°C operating temperature range
Videos
Pad Overview
Additional Resources
- TGP 7000ULM Sell Sheet
- Brochure: Materials for Wireless Infrastructure 5G Telecom Solutions
- Brochure: Material Solutions For Radar, Guidance System, and Aviation Industries
- Brochure: Material Solutions for Cloud/Hyperscale Datacenter Switches, Routers and Servers
- NASA Outgassing Approved Products
- Press Release: Henkel Innovations take Top Honors at IPC APEX EXPO Event
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Bergquist Company GAP PAD® Thermally Conductive Materials
Interface materials with greater conformability, higher thermal performance, and easier application.
Published: 2019-12-05
| Updated: 2023-06-09