Bergquist Company TGP 1000VOUS Ultra Conformable GAP PAD®
Bergquist TGP 1000VOUS Ultra Conformable GAP PAD® filling material provides ultra-conformable gel-like material with thermal conductivity of 1.0W/m-K. This filling material is ultra-soft and offers excellent low-stress vibration dampening and shock absorbency for applications requiring a minimum amount of pressure on components. Bergquist GAP PAD TGP 1000VOUS Filling Material is ideal for isolation between heat sinks and high-voltage, bare-leaded devices.
Features
- 1.0W/m-K thermal conductivity
- Conformable, low hardness
- Gel-like modulus
- Decreased strain
- Resists punctures, shears, and tears
- Electrically isolating
Applications
- Telecommunications
- Computer and peripherals
- Between heat-generating semiconductors or magnetic components and a heat sink
- Power conversion
- Area where heat needs to be transferred to a frame, chassis, or other types of heat spreader
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Application Example
Published: 2011-10-07
| Updated: 2022-12-15