Bergquist TGP 1000VOUS Ultra Conformable GAP PAD® filling material provides ultra-conformable gel-like material with thermal conductivity of 1.0W/m-K. This filling material is ultra-soft and offers excellent low-stress vibration dampening and shock absorbency for applications requiring a minimum amount of pressure on components. Bergquist GAP PAD TGP 1000VOUS Filling Material is ideal for isolation between heat sinks and high-voltage, bare-leaded devices.
1.0W/m-K thermal conductivity
Conformable, low hardness
Resists punctures, shears, and tears
Computer and peripherals
Between heat-generating semiconductors or magnetic components and a heat sink
Area where heat needs to be transferred to a frame, chassis, or other types of heat spreader