Vishay continues to set the industry standards for surface‑mount packages

DFN3820A:

• Product technologies include standard, Schottky, Ultrafast Rectifiers and TVS
• Low-profile package - dimension 3.8 mm x 2.0 mm with typical height of 0.88 mm
• Offers an AOI-capable package with wettable flanks
• Oxide planar chip technology
• Maximum current rating up to 7 A, equivalent to larger package performance
• Double the performance compared to SMP package
• AEC-Q101 and Vishay Automotive Grade

DFN1006-2A and DFN1110-3A:

• Technologies include: ESD Protection diodes, Zener diodes, Schottky diodes & Switching diodes
• Only 10% PCB board space consumption compared with traditional SOD/T packages
• Better thermal/power performance than traditional SOD/T packages
• Soldering can be checked by standard visual inspection
• No X-ray inspection necessary to meet automotive AOI requirements
• AEC-Q101 qualified and and Vishay Automotive Grade
• Uses non solder mask defined (NSMD) solder lands
• Uses the right amount of solder paste for proper stand-off and solder meniscus

Protect sensitive electronics against voltage transients. Vishay offers the broadest low-profile eSMP^® package portfolio.

Overall benefits:

• Fast, efficient, small
• Space-saving packages
• Excellent heat dissipation
• Low device height
• Low thermal resistance
• AEC-Q101 qualified
• Footprint reduction
• Lower profile
• AOI capable
• Enhanced current rating for rectifiers
• Enhanced surge power for TVS diodes

Standard Rectifiers and TVS, Two-in-One Solution:

• Two different technologies in one FlatPAK 5 x 6 package saves PCB space
• Automotive solution for standard rectiifier (600V, 3A) and TransZorb(R) TVS (200W, Vbr 27V)

TMBS Rectifiers and Fred Pt(r) Ultrafast Rectifiers:

• One package instead of two saves > 65% PCB space
• Increase power density and performance efficiency
• Low forward, low power losses