Multiprotocol Modules

Results: 1 523
Select Image Part # Mfr. Description Datasheet Availability Pricing (NOK) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Series Frequency Output Power Interface Type Supply Voltage - Min Supply Voltage - Max Minimum Operating Temperature Maximum Operating Temperature Antenna Connector Type Dimensions Protocol - Bluetooth, BLE - 802.15.1 Protocol - Cellular, NBIoT, LTE Protocol - GPS, GLONASS Protocol - Sub GHz Protocol - WiFi - 802.11 Protocol - ANT, Thread, Zigbee - 802.15.4 Qualification Packaging
RF Solutions Multiprotocol Modules Wi-Fi, BLE5.0, 32Bit MCU onboard Antenna SMD-22pin Non-Stocked
Min.: 1
Mult.: 1

RF Solutions Multiprotocol Modules Wi-Fi, BLE5.0, 32Bit MCU onboard Antenna SMD-16 Non-Stocked
Min.: 1
Mult.: 1

RF Solutions Multiprotocol Modules Wi-Fi, BLE5.0, 32Bit MCU External Antenna SMD-18 Non-Stocked
Min.: 1
Mult.: 1

RF Solutions Multiprotocol Modules Wi-Fi, BLE5.0, 32Bit MCU onboard Antenna SMD-38 Non-Stocked
Min.: 1
Mult.: 1

RF Solutions Multiprotocol Modules Wi-Fi, BLE5.0, 32Bit MCU onboard Antenna SMD-61 Non-Stocked
Min.: 1
Mult.: 1

RF Solutions Multiprotocol Modules Wi-Fi, BLE5.0, 32Bit MCU External Antenna SMD-61 Non-Stocked
Min.: 1
Mult.: 1

Jorjin Multiprotocol Modules Based on TI WL1833 and supports 802.11a/b/g/n and BT/BLE 4.2 Non-Stocked
Min.: 1 800
Mult.: 1 800
Reel: 1 800

2.4 GHz, 5 GHz 17 dBm SDIO, UART 2.9 V 4.8 V - 40 C + 85 C 12.8 mm x 12 mm x 1.63 mm Bluetooth 802.11 a/b/g/n Reel
SparkFun Multiprotocol Modules Digi XBee 3 North America LTE Cat 1, 3G, GNSS, no SIM Non-Stocked
Min.: 1
Mult.: 1
23 dBm SPI, UART, USB 2.8 V 5.5 V - 40 C + 85 C SMA 43.18 mm x 30.48 mm BLE 3G, LTE-M/NBIoT GNSS
SparkFun Multiprotocol Modules SparkFun BlueSMiRF v2

2.4 GHz 3.3 V 5 V Built-In 44.2 mm x 15.22 mm BLE, Bluetooth 4.2 BR/EDR 802.11 b/g/n
CEL Multiprotocol Modules CMP9670 Tri-Band Wi-Fi 6e 2x2 MU-MIMO DBS BT5.2 M.2 Card Non-Stocked
Min.: 500
Mult.: 500

CMP9670 PCIe, USB Bluetooth Bulk
CEL Multiprotocol Modules CMP9670 Tri-Band Wi-Fi 6e 2x2 MU-MIMO DBS BT5.2 Half-size Mini-PCIe Card Non-Stocked
Min.: 500
Mult.: 500

CMP9670 PCIe, USB Bluetooth Bulk
Silex Technology Multiprotocol Modules Based on NXP's RW610, IM-100 is a small, stand-alone, dual-band Wi-Fi 6 Non-Stocked Lead-Time 34 Weeks
Min.: 500
Mult.: 500
Reel: 500

260 MHz I2C, SPI, UART - 40 C + 85 C MHF 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Reel
Silex Technology Multiprotocol Modules IM-100 is a small, stand-alone, dual-band Wi-Fi 6 and Bluetooth Low Energy Non-Stocked Lead-Time 34 Weeks
Min.: 1
Mult.: 1

260 MHz I2C, SPI, UART - 40 C + 85 C MHF 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Cut Tape
Silex Technology Multiprotocol Modules the option to attach an antenna via a trace. does not include the u.Fl connector Non-Stocked Lead-Time 34 Weeks
Min.: 500
Mult.: 500
Reel: 500

260 MHz I2C, SPI, UART - 40 C + 85 C 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Reel
Silex Technology Multiprotocol Modules the option to attach an antenna via a trace does not include the u.Fl connector Non-Stocked Lead-Time 34 Weeks
Min.: 1
Mult.: 1

260 MHz I2C, SPI, UART - 40 C + 85 C 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Cut Tape
Silex Technology Multiprotocol Modules 2x2 Dual Band 802.11 ac WLAN+BT PCIe Non-Stocked Lead-Time 30 Weeks
Min.: 100
Mult.: 100

SX-PCEAC2 2.4 GHz, 5 GHz Serial 3.3 V 3.3 V 0 C + 70 C 30 mm x 26.8 mm x 3.4 mm Bluetooth 5.0 PCIe 802.11 a/b/g/n/ac Tray
Silex Technology Multiprotocol Modules 2x2 Dual Band 802.11 ac WLAN+BT SMT Non-Stocked Lead-Time 30 Weeks
Min.: 1 500
Mult.: 1 500
Reel: 1 500

SX-PCEAC2 2.4 GHz, 5 GHz Serial 3.3 V 3.3 V 0 C + 70 C 12 mm x 16 mm x 1.5 mm Bluetooth 5.0 802.11 a/b/g/n/ac Reel
Silex Technology Multiprotocol Modules 2x2 Dual Band 802.11 ac WLAN+BT SMT Non-Stocked Lead-Time 30 Weeks
Min.: 1
Mult.: 1

SX-PCEAC2 2.4 GHz, 5 GHz Serial 3.3 V 3.3 V 0 C + 70 C 12 mm x 16 mm x 1.5 mm Bluetooth 5.0 802.11 a/b/g/n/ac Cut Tape
Silex Technology Multiprotocol Modules [Bulk SKU] SX-PCEAX-M2 is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in an M.2 Card Type 2230-S3-A-E form factor. It is based on Qualcomm's QCA2066 chipset. Non-Stocked Lead-Time 40 Weeks
Min.: 100
Mult.: 100

SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe 3.3 V 3.3 V - 20 C + 65 C 22 mm x 30 mm x 2.7 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Tray
Silex Technology Multiprotocol Modules [Bulk SKU] SX-PCEAX-SMT is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in an M.2 LGA Type 1418 Surface Mount form factor. It is based on Qualcomm's QCA2066 chipset. Non-Stocked Lead-Time 40 Weeks
Min.: 1 200
Mult.: 1 200
Reel: 1 200

SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe 3.3 V 3.3 V - 20 C + 65 C 14 mm x 18 mm x 1.9 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Reel
Silex Technology Multiprotocol Modules 1x1 Wi-Fi+BLE radio /baseband SDIO Card Non-Stocked Lead-Time 30 Weeks
Min.: 100
Mult.: 100

SX-SDCAC Bluetooth 5.0 802.11 a/b/g/n/ac Bulk
Silex Technology Multiprotocol Modules 802.11ac+Bluetooth SDIO card SoC Non-Stocked Lead-Time 30 Weeks
Min.: 1
Mult.: 1

SX-PCEAC2 2.4 GHz, 5 GHz SDIO 3.135 V 3.465 V - 40 C + 85 C MHF4 24 mm x 51 mm x 5.8 mm Bluetooth 5.0 802.11 a/b/g/n/ac Bulk
Silex Technology Multiprotocol Modules The Silex SX-SDCAC Plus is a next generation 802.11a/b/g/n/ac plus Bluetooth SDIO card based on the QCA9377-3 System-on-Chip (SoC). The SX-SDCAC Plus is mechanically designed in a SD card form factor to provide customers with a vendor independent for Non-Stocked Lead-Time 30 Weeks
Min.: 1
Mult.: 1
Bulk
Silex Technology Multiprotocol Modules Wi-Fi+BLE Mod SM w/Ant uFl connector Non-Stocked Lead-Time 30 Weeks
Min.: 500
Mult.: 500
Reel: 500

SX-SDMAC 2.4 GHz, 5 GHz Bluetooth 5.0 802.11 a/b/g/n/ac Reel
Silex Technology Multiprotocol Modules Wi-Fi+BLE Mod SM w/Ant uFl con SamPck Non-Stocked Lead-Time 30 Weeks
Min.: 1
Mult.: 1

SX-SDMAC 2.4 GHz, 5 GHz Bluetooth 5.0 802.11 a/b/g/n/ac Cut Tape